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Decapsulation
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Probe Station Application
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LC Application
IC Grinding:Positioned/None-positioned
De-Gold Bump
X-Ray Application
SAM Application
Probe Station App.
Probe Station & Laser Cut

probing

 

Probing Test:

Acquiring IC internal signal with micro probing needles.

 

Laser Cutting:

Cutting metal lines or specific area on the top layer with laser cutter.


Left: direct probing

 
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